-
Most significant machine model for 300mm wafers
High precision, high rigidity, high throughput machine. -
Better cost performance for 300mm wafers.
-
300mm Framed wafer & CSP handling machine.
-
It is the prober with high-speed probing that targets non-memory device.
-
Most significant machine model for 200mm wafers
High precision, high rigidity machine. -
Highly efficient, High throughput, wafer & CSP handling machine.
Better cost performance machine. -
High-speed machine for discrete.
-
200mm Framed wafer & CSP handling machine
-
Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
-
Consolidated management of the operation of probing machines for higher operation rate.
-
This network allows you to consolidate the management of resources with the user host.
-
The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers.
-
This is a group of dedicated terminals for increasing the efficiency of test areas.
Pf300 Prober Manual Pdf
Next-generation high-spec probing machine UF3000 from the world No.1 supplier.
Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment. Charlie and lola.
Uf300 Prober Manual Online
- Feature 1: OTS - the newest positioning technology (Optical Target Scope)
- OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically. Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.
- Feature 2: QPU - super high-rigid chucking (Quad-Pod Unit)
- To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important. The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.
- Feature 3: Load-port
- Testing environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).
- Feature 4: TTG (Touch To Go)
- Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition.
It is the prober with high-speed probing that targets non-memory device. Probing Machine: UF2000. Most significant machine model for 200mm wafers High precision, high rigidity machine. Probing Machine: UF200R. Highly efficient, High throughput, wafer & CSP handling machine.
Pf300 Prober Manual Download
Dec 23, 2010 Major features include: New Tripod wafer chuck that is 50% more rigid than the conventional UF300 to allow for over 128 test sites and pin counts exceeding 9000 pins. Registering Image Data by MANUAL mode 1. Prober stops and buzzer sounds. Move CROSS MARK to street cross by J/S and then push DATA IN Switch. Push DATA IN Switch at reference point. Prober switches high magnification. Look for unique point inside die.